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SMD REWORK: - Advanced Rework - FINEPLACER® micro hvr |
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Advanced Rework: - |
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FINEPLACER® micro hvr
High Volume Rework Station
The FINEPLACER® micro hvr is a cost effective, fully-automated rework station, offering a high level of flexibility.
This award winning system is targeted for production environments where yield is crucial.
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Highlights: - |
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- Components from 0.25 mm x 0.25 mm to 90 mm x 80 mm*
- Board sizes up to 350 mm x 260 mm*
- Closed loop force control
- Fully automated operation and soldering process
- Precise non-wearing xy planar table
- Traceability support with open data interface structure
- Flexible, cost effective performance
- Placement accuracy 10 µm @ 3 sigma
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| Features |
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Benefits |
- Automated pattern recognition, alignment and soldering
- Overlay vision alignment system with fixed beam splitter
- Integrated Process Management (IPM)
- Adaptive process library
- Live process observation camera
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- Hands-off component placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Provides high level of application flexibility
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Identical results on different machines allow central profile development,administration and distribution
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| Technologies |
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Applications |
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- Soldering of:
- BGA, µBGA/CSP, QFN, PoP, QFP, PGA,
- Small passives down to 0201
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
- Flipchip (C4)
- Single ball rework
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| Technical Specifications |
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| Placement accuracy*: |
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10 µm @ 3 sigma |
| Field of view (min)1: |
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2.5 mm x 1.9 mm |
| Field of view (max)1: |
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17.5 mm x 13 mm |
| Component size (min)1: |
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0.25 mm x 0.25 mm |
| Component size (max)1: |
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50 mm x 50 mm |
| Theta fine travel / resolution: |
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± 4° / 1.0° |
| X-travel / resolution: |
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380 mm / 0.64 µm |
| Y-travel / resolution: |
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155 mm / 0.64 µm |
| Z-travel / resolution: |
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8 mm / 0.8 µm |
| Top Heating: |
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| Power: |
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900 W |
| Temperature ramp rate: |
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1 K/s - 50 K/s |
| Flow range: |
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10 Nl/min - 70 Nl/min |
| Board Heating: |
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| Power: |
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1400 W |
| Heated area (max): |
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330 mm x 170 mm |
| Flow range: |
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48 Nl/min |
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| Modules & Options |
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* depending on configuration/application
1 standard value, other values on request
2 optional module
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